JPS5465668U - - Google Patents
Info
- Publication number
- JPS5465668U JPS5465668U JP13956277U JP13956277U JPS5465668U JP S5465668 U JPS5465668 U JP S5465668U JP 13956277 U JP13956277 U JP 13956277U JP 13956277 U JP13956277 U JP 13956277U JP S5465668 U JPS5465668 U JP S5465668U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13956277U JPS5465668U (en]) | 1977-10-17 | 1977-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13956277U JPS5465668U (en]) | 1977-10-17 | 1977-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5465668U true JPS5465668U (en]) | 1979-05-10 |
Family
ID=29113733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13956277U Pending JPS5465668U (en]) | 1977-10-17 | 1977-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5465668U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126414U (ja) * | 1984-07-23 | 1986-02-17 | 小木戸 利幸 | 小鍋 |
| JP2015109294A (ja) * | 2013-12-03 | 2015-06-11 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4216567Y1 (en]) * | 1965-03-08 | 1967-09-25 | ||
| JPS492261B1 (en]) * | 1970-09-09 | 1974-01-19 | ||
| JPS49123583A (en]) * | 1973-03-30 | 1974-11-26 |
-
1977
- 1977-10-17 JP JP13956277U patent/JPS5465668U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4216567Y1 (en]) * | 1965-03-08 | 1967-09-25 | ||
| JPS492261B1 (en]) * | 1970-09-09 | 1974-01-19 | ||
| JPS49123583A (en]) * | 1973-03-30 | 1974-11-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6126414U (ja) * | 1984-07-23 | 1986-02-17 | 小木戸 利幸 | 小鍋 |
| JP2015109294A (ja) * | 2013-12-03 | 2015-06-11 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |